Data Center (Cloud & Big Data)

Hyperscale Connectivity for the AI Era

With the explosion of AIGC and cloud computing, internal data center traffic is growing exponentially. PhotonIC provides high-performance, low-power optical interconnect chips to solve the bandwidth bottleneck of computing clusters.

The Challenge

In the 800G/1.6T era, traditional DSP solutions share serious power consumption challenges, and signal integrity is difficult to scale linearly with speed, leading to soaring cooling costs.

Our Solution

Our Linear Drive (LPO) solution removes the traditional DSP, significantly reducing power (Low Power) and latency (Low Latency), making it the preferred choice for next-generation green data centers.

Key Metrics

  • 800G Bandwidth
  • <10pJ/bit Energy Efficiency
  • Ultra-Low Latency

Technical Details

  • AI Training Clusters
  • Hyperscale Cloud
  • High-Performance Computing

Specific Use Cases

  • AI Training Clusters
  • Hyperscale Cloud
  • High-Performance Computing

5G Infrastructure

Enabling Ultra-Reliable Low Latency Communication

The construction of high-density 5G base stations requires massive high-speed optical module support. Our chips maintain extremely high reliability even in extreme temperature environments.

The Challenge

Fronthaul network equipment is often deployed outdoors, facing harsh environments such as high temperatures and humidity, placing extremely high demands on the industrial-grade reliability of chips.

Our Solution

PhotonIC's 25G/50G DML driver and TIA chips have passed strict industrial-grade certification, ensuring stable operation within a wide temperature range of -40°C to 85°C to empower large-scale 5G deployment.

Key Metrics

  • Temp Range: -40~85°C
  • Data Rate: 25G/50G
  • Industrial Reliability

Technical Details

  • 5G Fronthaul
  • Telecom Basestations
  • Outdoor Network Units

Specific Use Cases

  • 5G Fronthaul
  • Telecom Basestations
  • Outdoor Network Units

Automotive LiDAR

The Eyes of Autonomous Driving

LiDAR is the core sensor for L4/L5 autonomous driving. We provide high-power, nanosecond-pulse driver chips to let vehicles see further and clearer.

The Challenge

To detect low-reflectivity objects over 200 meters away, LiDAR needs to emit extremely narrow and high-power laser pulses, which is a huge test for the transient response speed of driver chips.

Our Solution

Our multi-channel LiDAR driver chip (High-Side MUX) can generate high-current nanosecond narrow pulses, significantly improving detection range and resolution, and meets AEC-Q100 automotive standards.

Key Metrics

  • Peak Power: 100W+
  • Pulse Width: <5ns
  • AEC-Q100 Grade

Technical Details

  • L4 Autonomous Driving
  • Robotaxi Fleets
  • Smart Highways

Specific Use Cases

  • L4 Autonomous Driving
  • Robotaxi Fleets
  • Smart Highways

Consumer Electronics

Immersive Interactions & 3D Sensing

From mobile face unlock to immersive AR/VR experiences, 3D sensing technology is changing how humans interact with machines. We provide complete iTOF/dTOF driver solutions.

The Challenge

Space inside mobile devices is precious, requiring chips to maximize performance while achieving extreme miniaturization and low power consumption to extend battery life.

Our Solution

PhotonIC launches industry-leading highly integrated iTOF/dTOF drivers and sensors using advanced packaging processes to help OEMs build thin, smart next-generation consumer terminals.

Key Metrics

  • Power: mW-level
  • Integration: SiP / SoC
  • Form Factor: Ultra-Compact

Technical Details

  • Face Unlock / Biometrics
  • AR/VR Headsets
  • Smartphone Photography

Specific Use Cases

  • Face Unlock / Biometrics
  • AR/VR Headsets
  • Smartphone Photography